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2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm

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2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm

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Brand Name : CESGATE

Model Number : NA

Certification : ISO9001/ ISO14001

Place of Origin : China

MOQ : 1PCS( NO MOQ)

Price : Negotiable (Depends on your GERBER and BOM)

Payment Terms : T/T, L/C

Supply Ability : 30,000pcs/month

Delivery Time : 1-30 working days

Packaging Details : PCB: Vacuum Packing / PCBA: ESD Packing

Product name : Bldc Fan Circuit Board Smt Control Board PCB Prototype Service Sap Pm Bom

Type : Rapid Prototyping, Other Machining Services, Rapid Prototyping

Optional Service : 3 4 5 6 Axis CNC Machining Service

Min. line spacing : 4mil, 0.003", 0.1mm4mil), 0.1mm, 4/4mil(0.1/0.1mm)

Min. line width : 4mil, 0.1mm, 0.1mm/4mi, 0.075mm/0.075mm(3mil/3mil), 3mi

Min. hole size : 0.2mm, 8 mil, 0.10mm, 3mil (0.075mm), 0.004"

Drawing Format : 2D(PDF/CAD) And 3D(IGES/STEP)

Application : Consumer Electronics, power, automotive, industry, Electronic product

Contact Now

Bldc Fan Circuit Board Smt Control Board PCB Prototype Service Sap Pm Bom

CESGATE Offering

1. 7/24 Sales and technical support
2. Felxible payment methods and negotiable payment terms
3. Both samples and bulk orders are supported
4. More than 10 years overseas export experience, flexible handling of transportation and customs clearance issues

PCB prototype service Capacities and Technical Specification

NO. Items Capabilities
1 Layers 2-68L
2 Maximum machining size 600mm*1200mm
3 Board thickness 0.2mm-6.5mm
4 Copper thickness 0.5oz-28oz
5 Min trace/space 2.0mil/2.0mil
6 Minimum finished aperture 0. 10mm
7 Maximum thickness to diameter ratio 15:1
8 Via treatment Via, blind&buried via, via in pad, Copper in via …
9 Surface finish/treatment HASL/HASL lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
10 Base Material FR408 FR408HR, PCL-370HR;IT180A, Megtron 6(Panasonic);Rogers4350,
Rogers4003, RO3003, Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
11 Solder mask color Green.Black.Red.Yellow.White.Blue.Purple.Matte Green. Matte Black
12 Testing Service AOI, X-Ray, Flying-Probe, Function Test, First Article Tester
13 Profiling Punching Routing,V-CUT,Beveling
14 Bow&twist ≤0.5%
15 HDI type 1+n+1,2+n+2,3+n+3
16 Min mechanical aperture 0.1mm
17 Min laser aperture 0.075mm

PCBA Capabilities

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO SMT and DIP lines
Lead Time Prototype : 15 work days. Mass order : 20~25 work days
Testing on products Testing jig/mold , X-ray Inspection, AOI Test, Functional test
Quantity Min quantity : 1pcs. Prototype, small order, mass order, all OK
Files needed PCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file
PCB Panel Size Min size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm
Components details Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape, Tube, Reels, Loose Parts
PCB+ assembly process Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

Briefly Introduce Our Strength

1. Can reduce PCB cost. When the prototype PCB service density increases beyond eight layers, it is manufactured by HDI and its cost will be lower than the traditional complex pressing process.
2. Increase circuit density, interconnection of traditional circuit boards and parts
3. Promote the use of advanced building techniques
4. Has better electrical performance and signal accuracy
5. Better reliability
6, can improve thermal performance
7. Can improve RFI/EMI/ESD (RFI/EMI/ESD)
8. Improve design efficiency

Application

Printed circuit boards (PCBs) are indispensable accessories in modern electronic devices. Printed circuit boards are used in all electronic equipment, whether it is large machinery or personal computers, communication base stations or mobile phones, household appliances or electronic toys. .Printed circuit boards are mainly composed of insulating substrates and conductors, which play the role of support, interconnection and part of circuit elements in electronic equipment. Electronic components such as integrated circuits, resistors, capacitors, etc. cannot function as a single entity. They only work as a whole if they have a firm foothold on the prototype PCB service and there are conductive junctions connecting them. Prototype PCB serviceThe printed circuit board is the skeleton that supports the components and is the conduit for connecting electrical signals. In addition, some printed circuit boards have components such as resistors, capacitors, inductors, etc., which become functional circuits and play the role of trachea.

2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm

2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm

2D 3D Bldc Fan Circuit Board PCB Prototype Service 600mm*1200mm

FAQ

Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F
Q: What is the difference between the HDI board and the general circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit boards only use mechanical drilling, and HDI boards are manufactured by the build-up method (Build Up), so more layers will be added, while general circuit boards are only added once.
Q: MOQ?
CESGATE: There is no MOQ in POE. We are able to flexibly handle small and large batches.
Q: Can you give us a preferential discount?
CESGATE: Of course, we will offer a preferential discount for your large orders and confirm the order quickly.
Q: The lead-free process is required when the circuit board is printed. What should I pay attention to when making the circuit board?
CESGATE: The lead-free process during printing is higher than the temperature resistance requirements of the general process, and the temperature resistance requirements must be above 260 °C. Therefore, it is recommended to use a substrate above TG150 when selecting the substrate material.
Q: What modes of transport are there?
CESGATE: Usually includes express, air shipment, rail shipment and sea shipment.


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